A larger / large enough heat sink will also keep temperatures low. This is the Best (Only?) solution for this design (see below).
While 2 parallel transistors will share the heat dissipation and, there are other factors to consider, some of which include:
1. Two Parallel transistors will present a larger (too large in this case) load for the Bootstrapped Driver to handle. Distortion and transient response will suffer.
2. The 2 Paralleled Transistors (in any design) will have atleast slightly different characteristics, including static parameters like hfe (current Gain), internal emitter Resistance, as well as dynamic characteristics such as transient response.
There is one school of thought that phoo phoos multiple, paralled output devices, as the 2 paralleed devices could be "fighting each other" when in use. Individual emitter resistors for each output device help reduce "current hogging" but do not resolve the difference in dynamic characteristics between multiple output devices.
Ofcourse, there are a large number of commercial designs that use multiple., paralleled devices out of sheer necicity, but their Driver stage must be designed accordingly. Even after that, a certain level of performance compromise remains inherent.
The JLH Class A audio amp follows the KISS principle

(Keep It Simple, Stupid) ... so I would recommend a larger heatsink

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